Onto Innovation Inc. Common Stock (ONTO)

Onto Innovation Inc. (NYSE: ONTO) will release its 2025 first quarter results shortly after the market closes on May 8, 2025. Onto Innovation will host a conference call and audio webcast in connection with its release of the financial results. Michael P. Plisinski, chief executive officer, and Mark Slicer, chief financial officer, will host the call. The call will take place:

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced financial results for the fourth quarter and full year 2024.

Onto Innovation Inc. (NYSE: ONTO) will release its 2024 fourth quarter and full year results shortly after the market closes on February 6, 2025. Onto Innovation will host a conference call and audio webcast in connection with its release of the financial results. Michael P. Plisinski, chief executive officer, and Mark Slicer, chief financial officer, will host the call. The call will take place:

Onto Innovation Inc. (NYSE: ONTO) today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di™ technology on the Dragonfly® G3 system for bump process control in high bandwidth memory (HBM) and advanced logic applications. Additionally, the EchoScan™ system is introduced for detecting voids as small as 1µm in wafer bonding applications, such as advanced hybrid bonding for Cu-Cu interconnects. Initial orders for the 3Di technology include a top HBM manufacturer, a tier one OSAT and a leading manufacturer of bump process equipment. The first EchoScan system will ship in the first quarter, with additional tools planned to ship to customers throughout 2025.

Onto Innovation Inc. (NYSE: ONTO) today announced that a leading DRAM manufacturer has finalized a $69 million volume purchase agreement spanning Onto Innovation’s optical metrology ecosystem, including common films, optical critical dimension, and integrated metrology. This agreement implies increased adoption of the Iris™ system for common films metrology, along with increased adoption of integrated metrology. Deliveries begin in the first quarter of 2025, supporting management’s expectations for the start of a recovery in the DRAM market in 2025.

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced that Michael Plisinski, chief executive officer, and Mark Slicer, chief financial officer, will participate in the upcoming 27th Annual Needham Growth Conference, taking place at the Lotte New York Palace Hotel on January 15, 2025.

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced financial results for the third fiscal quarter of 2024.

Onto Innovation Inc. (NYSE: ONTO), a global provider of process control and packaging lithography solutions to the semiconductor market, today announced that it has acquired Lumina Instruments, Inc. based in Milpitas, California.

Onto Innovation Inc. (NYSE: ONTO) will release its 2024 third quarter results shortly after the market closes on October 31, 2024. Onto Innovation will host a conference call and audio webcast in connection with its release of the financial results. Michael P. Plisinski, chief executive officer, and Mark Slicer, chief financial officer, will host the call. The call will take place:

Onto Innovation Inc. (NYSE: ONTO) today announced the opening of the company’s Packaging Applications Center of Excellence (PACE), a first-of-its-kind facility in the U.S. dedicated to panel-level packaging (PLP) innovations enabling 2.5D and 3D chiplet architectures and AI packages. Collaborating partners represent key process steps across the supply chain, ranging from panel package and IC substrate manufacturers to process equipment and material suppliers. Collaborators include: ASMPT, Corning, Evatec, Lam Research, LPKF Laser & Electronics SE, MKS Instruments, Resonac Corporation, Taiyo Ink Mfg. Co., Ltd., and multiple others.

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced that its senior management team will participate in the following upcoming investor events:

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced financial results for the second fiscal quarter of 2024.

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation”, “Onto”, or the “Company”) today announced Dr. Stephen Schwartz has joined its board of directors.

Onto Innovation Inc. (NYSE: ONTO) will release its 2024 second quarter results shortly after the market closes on August 8, 2024. Onto Innovation will host a conference call and audio webcast in connection with its release of the financial results. Michael P. Plisinski, chief executive officer, and Mark Slicer, chief financial officer, will host the call. The call will take place:

Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep® X500 panel-level packaging lithography system with hybrid substrate handling capabilities and the Firefly® G3 sub-micron automatic metrology and inspection system for panel-level packaging and advanced IC substrates (AICS). The JetStep X500 and Firefly G3 systems offer customers a complete panel-level packaging solution supporting heterogeneous integration (HI) chiplet packages for AI, high performance compute and cloud computing. The AICS market is expected to increase at a compound annual growth rate of 10% from 2023 to 2028, according to Prismark.

Onto Innovation Inc. (NYSE: ONTO) today announced it will be exhibiting at SEMICON West on July 9-11, 2024. Onto Innovation invites customers to booth 633 to learn about the Company’s latest portfolio of integrated process and process control solutions being used to support its customers’ ramp of AI products. Onto will feature a selection of its latest technologies helping to enable advanced packaging, including lithography for next generation AI and chiplet designs employing cutting edge panel-level production technologies (CCL and glass handling) and unique 3D metrology and inspection capabilities in support of next generation bump technologies. In addition, Onto will feature metrology solutions for advanced node logic (CPU/GPU) and memory (HBM, DRAM and NAND) applications; and a range of technologies for the production of specialty devices, including those for GaN and SiC, powering the advanced automotive market and electric vehicles. Onto’s product experts will be at the booth to answer specific applications questions.

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced that its senior management team will participate in the following upcoming investor events:

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced financial results for the first fiscal quarter of 2024.

Onto Innovation Inc. (NYSE: ONTO) today announced the release of a new sub-surface inspection capability for the Dragonfly® G3 sub-micron 2D/3D inspection and metrology platform. The new capability enables whole wafer inspection for critical yield impacting defects that can lead to lost die as well as entire wafers breaking in subsequent process steps. Such defects were previously impossible to find in a production environment. In today’s world of wafer thinning and multi-layer wafer or die bonding, sub-surface defects are far more dangerous than ever before as bonded layers are now a tenth of their former thickness and far more brittle and therefore more susceptible to damage pre- or post-bonding. Sub-surface defects that occur during the bonding or thinning process such as micro-cracks can cause not only die yield issues, but wafers can be shattered resulting in the loss of hundreds of die in an instant.

Onto Innovation Inc. (NYSE: ONTO) will release its 2024 first quarter results shortly after the market closes on May 9, 2024. Onto Innovation will host a conference call and audio webcast in connection with its release of the financial results. Michael P. Plisinski, chief executive officer, and Mark Slicer, chief financial officer, will host the call. The call will take place:

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced that Michael Sheaffer plans to retire from the Company in July this year. A successor search has now been successfully completed with Sidney Ho joining Onto Innovation as vice president of investor relations. Mr. Sheaffer will remain fully engaged in the investor relations role and will be the primary investor contact point until Mr. Ho assumes that responsibility during the Company’s investor meetings at SEMICON® West in July 2024.

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation”, “Onto”, or the “Company”) today announced Susan Lynch has joined its board of directors.

Onto Innovation Inc. (NYSE: ONTO) and its Tucson subsidiary 4D Technology today announced they’ve been named winner of FANUC America’s prestigious 2024 Innovative System of the Year award for the 4Di InSpec automated metrology system (AMS). The system enables automated surface defect and feature metrology for aviation, aerospace and other applications in the industrial manufacturing market. The patented, vibration-immune technology enables the unique capability of using non-contact, three-dimensional optical metrology on the production floor, providing new levels of defect inspection with micrometer-level resolution. In partnership with OptiPro Systems, the 4Di InSpec AMS systems were delivered in the second half of 2023 to several leading aerospace engine manufacturers.

Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced financial results for the fourth quarter and full year 2023.

Onto Innovation Inc. (NYSE: ONTO) today announced the launch of the new Firefly® G3 inspection and metrology system for automated process control during high volume production of panel-level substrates. The Firefly G3 system was shipped to a tier one customer supporting a variety of AI chiplet based panel-level packages with several additional customers expected to take delivery in the first half of 2024. The Firefly G3 system’s inspection and metrology capabilities uniquely complement Onto’s JetStep® family of panel-level lithography systems, using proprietary feed-forward and feedback software, providing high-resolution data to optimize layer-over-layer overlay accuracy throughout all layers on each side of the panel being processed, a unique capability in improving current panel performance and yield.